CI 9260 ELECTRONICS MANUFACTURING TECHNOLOGY SYLLABUS | ANNA UNIVERSITY ME COMPUTER INTEGRATED MANUFACTURING ELECTIVES SYLLABUS REGULATION 2009 2011 2012-2013 BELOW IS THE ANNA UNIVERSITY M.E COMPUTER INTEGRATED MANUFACTURING DEPARTMENT ELECTIVES SYLLABUS, TEXTBOOKS, REFERENCE BOOKS,EXAM PORTIONS,QUESTION BANK,PREVIOUS YEAR QUESTION PAPERS,MODEL QUESTION PAPERS, CLASS NOTES, IMPORTANT 2 MARKS, 8 MARKS, 16 MARKS TOPICS. IT IS APPLICABLE FOR ALL STUDENTS ADMITTED IN THE YEAR 2011 2012-2013 (ANNA UNIVERSITY CHENNAI,TRICHY,MADURAI,TIRUNELVELI,COIMBATORE), 2009 REGULATION OF ANNA UNIVERSITY CHENNAI AND STUDENTS ADMITTED IN ANNA UNIVERSITY CHENNAI DURING 2010
CI 9260 ELECTRONICS MANUFACTURING TECHNOLOGY L T P C
3 0 0 3
AIM:
This course aims at providing knowledge in the field of electronic manufacturing and
packaging.
OBJECTIVES:
Upon completion of this course students will able to
1. Understand various steps in wafer preparation
2. Describe the method of manufacture and types of Printed circuit board(PCB)
3. Describe various components in THT and SMT
4. Explain Soldering and cleaning in Electronic packaging
5. Describe Surface Mount Technology (SMT)
6. Explain inspection, testing and rework of populated PCB.
17
UNIT I INTRODUCTION TO ELECTRONICS MANUFACTURING 8
History, definition, wafer preparation by growing, machining, and polishing, diffusion,
microlithography, etching and cleaning, Printed Circuit Boards, types- single sided,
double sided, multi layer and flexible printed circuit board, design, materials,
manufacturing, inspection. Electronic packaging – Through Hole Technology (THT)
and Surface Mount Technology (SMT)
UNIT II COMPONENTS AND PACKAGING: 9
Through-hole components – axial, radial, multi leaded, odd form. Surface mount
components- active, passive. Interconnections - chip to lead interconnection, die
bonding, wire bonding, TAB, Flip chip, chip on board, multi chip module, direct chip
array module, leaded, leadless, area array and embedded packaging, miniaturization
and trends.
UNIT III SOLDERING AND CLEANING 9
Soldering theory, effect of elemental constituents on wetting, microstructure and
soldering, solder paste technology – fluxing reactions, flux chemistry, solder powder,
solder paste composition and manufacturing, solder paste rheology, Wave soldering.
Adhesive and solder paste application. solder system variables. soldering
temperature profile. Reflow soldering - profile generation and control, soldering
quality and defects. Post solder cleaning and selection. Measurement of cleanliness
levels.
UNIT IV SURFACE MOUNT TECHNOLOGY 11
SMT Equipment and Material Handling Systems, Handling of Components and
Assemblies - Moisture Sensitivity and ESD, Safety and Precautions Needed, IPC
and Other Standards, Stencil Printing Process, solder paste storage and handling,
stencils and squeegees, process parameters, quality control - Component Placement,
Equipment Type, Chip shooter, IC placer, Flexibility, Accuracy of Placement,
Throughput, reflow soldering, adhesive, underfill and encapsulation process,
applications, storage and handling, process & parameters.
UNIT V INSPECTION, TEST AND REWORK FOR PCB 8
Inspection Techniques, Equipment and Principle – AOI, X-ray, stencil printing
process- defects & corrective action, component placement process - defects &
corrective action, Reflow Soldering Process- defects & corrective action, underfill
and encapsulation Process- defects & corrective action, Testing of assemblies, Incircuit
testing (ICT), functional testing, testing jigs and fixtures concept of yield,
Rework and Repair, tools, rework criteria and process, Design for - Manufacturability,
Assembly, Reworkability, Testing, Reliability and Environment.
TOTAL: 45 PERIODS
TEXT BOOKS :
1. Ning Cheng LEE, “Reflow Soldering Process and Trouble Shooting – SMT, BGA,
CSP and Flip Chip Technologies”, Newnes Elsevier, 2001
2. Gurnett, Keith W., “Surface Mount Handbook”, Newnes Elsevier , 1999
3. Donald Seraphim, Ronald C. Lasky, Che-Yu Li, “Principles of Electronic
Packaging” Mcgraw-Hill, 1989.
REFERENCES :
1. Rudolf Strauss, “ SMT Soldering Handbook”, Newnes Elsevier , 1998
2. Peter Van Zant, “ Microchip Fabrication – a practical guide to semiconductor
processing”McGraw Hill, 2000
3. Thomas L.Landers, “Electronics Manufacturing Processes”, Prentice Hall, 1998
18
4. Prasad R.P., “Surface Mount Technology: Principles and Practice”, New York :
Chapman and Hall, 1997.
5. Clyde F.Coombs,Jr., “ Printed Circuits Handbook ” Mc Graw-Hill Hand books
Sixth Edition, 2008
CI 9260 ELECTRONICS MANUFACTURING TECHNOLOGY L T P C
3 0 0 3
AIM:
This course aims at providing knowledge in the field of electronic manufacturing and
packaging.
OBJECTIVES:
Upon completion of this course students will able to
1. Understand various steps in wafer preparation
2. Describe the method of manufacture and types of Printed circuit board(PCB)
3. Describe various components in THT and SMT
4. Explain Soldering and cleaning in Electronic packaging
5. Describe Surface Mount Technology (SMT)
6. Explain inspection, testing and rework of populated PCB.
17
UNIT I INTRODUCTION TO ELECTRONICS MANUFACTURING 8
History, definition, wafer preparation by growing, machining, and polishing, diffusion,
microlithography, etching and cleaning, Printed Circuit Boards, types- single sided,
double sided, multi layer and flexible printed circuit board, design, materials,
manufacturing, inspection. Electronic packaging – Through Hole Technology (THT)
and Surface Mount Technology (SMT)
UNIT II COMPONENTS AND PACKAGING: 9
Through-hole components – axial, radial, multi leaded, odd form. Surface mount
components- active, passive. Interconnections - chip to lead interconnection, die
bonding, wire bonding, TAB, Flip chip, chip on board, multi chip module, direct chip
array module, leaded, leadless, area array and embedded packaging, miniaturization
and trends.
UNIT III SOLDERING AND CLEANING 9
Soldering theory, effect of elemental constituents on wetting, microstructure and
soldering, solder paste technology – fluxing reactions, flux chemistry, solder powder,
solder paste composition and manufacturing, solder paste rheology, Wave soldering.
Adhesive and solder paste application. solder system variables. soldering
temperature profile. Reflow soldering - profile generation and control, soldering
quality and defects. Post solder cleaning and selection. Measurement of cleanliness
levels.
UNIT IV SURFACE MOUNT TECHNOLOGY 11
SMT Equipment and Material Handling Systems, Handling of Components and
Assemblies - Moisture Sensitivity and ESD, Safety and Precautions Needed, IPC
and Other Standards, Stencil Printing Process, solder paste storage and handling,
stencils and squeegees, process parameters, quality control - Component Placement,
Equipment Type, Chip shooter, IC placer, Flexibility, Accuracy of Placement,
Throughput, reflow soldering, adhesive, underfill and encapsulation process,
applications, storage and handling, process & parameters.
UNIT V INSPECTION, TEST AND REWORK FOR PCB 8
Inspection Techniques, Equipment and Principle – AOI, X-ray, stencil printing
process- defects & corrective action, component placement process - defects &
corrective action, Reflow Soldering Process- defects & corrective action, underfill
and encapsulation Process- defects & corrective action, Testing of assemblies, Incircuit
testing (ICT), functional testing, testing jigs and fixtures concept of yield,
Rework and Repair, tools, rework criteria and process, Design for - Manufacturability,
Assembly, Reworkability, Testing, Reliability and Environment.
TOTAL: 45 PERIODS
TEXT BOOKS :
1. Ning Cheng LEE, “Reflow Soldering Process and Trouble Shooting – SMT, BGA,
CSP and Flip Chip Technologies”, Newnes Elsevier, 2001
2. Gurnett, Keith W., “Surface Mount Handbook”, Newnes Elsevier , 1999
3. Donald Seraphim, Ronald C. Lasky, Che-Yu Li, “Principles of Electronic
Packaging” Mcgraw-Hill, 1989.
REFERENCES :
1. Rudolf Strauss, “ SMT Soldering Handbook”, Newnes Elsevier , 1998
2. Peter Van Zant, “ Microchip Fabrication – a practical guide to semiconductor
processing”McGraw Hill, 2000
3. Thomas L.Landers, “Electronics Manufacturing Processes”, Prentice Hall, 1998
18
4. Prasad R.P., “Surface Mount Technology: Principles and Practice”, New York :
Chapman and Hall, 1997.
5. Clyde F.Coombs,Jr., “ Printed Circuits Handbook ” Mc Graw-Hill Hand books
Sixth Edition, 2008
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