PD9251 MICRO ELECTRO MECHANICAL SYSTEMS SYLLABUS | ANNA UNIVERSITY ME CAD COMPUTER AIDED DESIGN 1ST SEM SYLLABUS REGULATION 2009 2011 2012-2013 BELOW IS THE ANNA UNIVERSITY FIRST SEMESTER ME CAD COMPUTER AIDED DESIGN DEPARTMENT SYLLABUS, TEXTBOOKS, REFERENCE BOOKS,EXAM PORTIONS,QUESTION BANK,PREVIOUS YEAR QUESTION PAPERS,MODEL QUESTION PAPERS, CLASS NOTES, IMPORTANT 2 MARKS, 8 MARKS, 16 MARKS TOPICS. IT IS APPLICABLE FOR ALL STUDENTS ADMITTED IN THE YEAR 2011 2012-2013 (ANNA UNIVERSITY CHENNAI,TRICHY,MADURAI,TIRUNELVELI,COIMBATORE), 2009 REGULATION OF ANNA UNIVERSITY CHENNAI AND STUDENTS ADMITTED IN ANNA UNIVERSITY CHENNAI DURING 2009
PD9251 MICRO ELECTRO MECHANICAL SYSTEMS L T P C
3 0 0 3
UNIT I INTRODUCTION 8
Introduction, Materials-substrates, Additive materials. Fabrication techniques-
Deposition, Lithography, etching, Surface micro machining, Thick film screen-printing
and electroplating
UNIT II MECHANICAL SENSOR PACKAGING 8
Introduction, Standard IC packages-ceramic, plastic and metal packages. Packaging
process-Electrical interconnects, Methods of die attachment, sealing techniques.
MEMS mechanical sensor packaging
UNIT III MECHANICAL TRANSDUCTION TECHNIQUES 9
Piezo resistivity, Piezoelectricity, Capacitive Techniques, Optical techniques,
Resonant techniques. Actuation techniques, Smart Sensors. MEMS Simulation and
Design tools-Behavioral model ling simulation tools and Finite element simulation
tools.
UNIT IV PRESSURE SENSORS 12
Introduction. Techniques for sensing. Physics of pressure sensing-Pressure sensor
specifications. Dynamic pressure sensing. Pressure sensor types. MEMS technology
pressure sensors-Micro machined silicon diaphragms,
UNIT V FORCE, TORQUE AND INERTIAL SENSORS 8
Introduction-Silicon based devises-Optical devises-capacitive devises-Magnetic
devices-Atomic force microscope and scanning probes- micro machined
accelerometer-Micro machined Gyroscope-Future inertial micro machined sensors
TOTAL: 45 PERIODS TEXT BOOK:
1. Nadim Maluf and Kirt Williams,’ An introduction to Micro electro mechanical
System Engineering, Artech House, Inc. Boston.2003
REFERENCE:
1. Stephen Beeby, Graham Ensell, Michael Kraft and Neil White,’ MEMS
Mechanical sensors’ Artech House, Inc. Boston 2003
PD9251 MICRO ELECTRO MECHANICAL SYSTEMS L T P C
3 0 0 3
UNIT I INTRODUCTION 8
Introduction, Materials-substrates, Additive materials. Fabrication techniques-
Deposition, Lithography, etching, Surface micro machining, Thick film screen-printing
and electroplating
UNIT II MECHANICAL SENSOR PACKAGING 8
Introduction, Standard IC packages-ceramic, plastic and metal packages. Packaging
process-Electrical interconnects, Methods of die attachment, sealing techniques.
MEMS mechanical sensor packaging
UNIT III MECHANICAL TRANSDUCTION TECHNIQUES 9
Piezo resistivity, Piezoelectricity, Capacitive Techniques, Optical techniques,
Resonant techniques. Actuation techniques, Smart Sensors. MEMS Simulation and
Design tools-Behavioral model ling simulation tools and Finite element simulation
tools.
UNIT IV PRESSURE SENSORS 12
Introduction. Techniques for sensing. Physics of pressure sensing-Pressure sensor
specifications. Dynamic pressure sensing. Pressure sensor types. MEMS technology
pressure sensors-Micro machined silicon diaphragms,
UNIT V FORCE, TORQUE AND INERTIAL SENSORS 8
Introduction-Silicon based devises-Optical devises-capacitive devises-Magnetic
devices-Atomic force microscope and scanning probes- micro machined
accelerometer-Micro machined Gyroscope-Future inertial micro machined sensors
TOTAL: 45 PERIODS TEXT BOOK:
1. Nadim Maluf and Kirt Williams,’ An introduction to Micro electro mechanical
System Engineering, Artech House, Inc. Boston.2003
REFERENCE:
1. Stephen Beeby, Graham Ensell, Michael Kraft and Neil White,’ MEMS
Mechanical sensors’ Artech House, Inc. Boston 2003
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